Solid-Liquid Interdiffusion Bonding between Ti/Ni/Ag/Sn Backside Metallized Si Chips and Cu/Al2O3 – DBC Substrates with Au/Pd/Ni Surface Finish by Avestia | Feb 7, 2022 | Recent Publication
Intelligent Data-Driven Models for Simulating Formwork Labour Productivity in High Rise Buildings by Avestia | Jan 6, 2022 | Recent Publication
Numerical Investigation of the Optimization of PV-System Performances Using a Composite PCM-Metal Matrix for PV-Solar Panel Cooling System by Avestia | Dec 15, 2021 | Recent Publication
Using Deep Learning for Efficient Diagnoses of COVID-19, Viral Illnesses (Other than COVID-19), and Bacterial Illnesses by Avestia | Nov 29, 2021 | Recent Publication
MODBUS: A Target for Covert Communication in Iot Devices by Avestia | Nov 22, 2021 | Recent Publication
The Effect of Sterilization on the Bovine Pericardium Scaffold Decellularized By the Glutaraldehyde-Free Technology by Avestia | Nov 22, 2021 | Recent Publication
