Yin-Hsuan Chen, Yen-Ting Chen,Tung-Han Chuang

Abstract: Nanotwinned structure has been attracting a great deal of attention due to their excellent mechanical and electrical properties. In this study, ultra-thin nanotwinned Ag films can be fabricated by DC magnetron sputtering with moderate substrate bias. Within these nanotwinned films, only 100-400 nm thick equiaxed-grin transition layer was formed between the nanotwinned region and Si substrate observed by Focused ion Beam (FIB). For the analysis of nanotwinned films, the as-deposited films are shown to have a strong (111) preferred orientation. The roughness of the films was observed below 10 nm, which was smooth enough and acceptable for metal direct bonding. Ag-to-Ag direct bonding was then performed to satisfy the requirement of TSV interconnections. The ultra-thin nanotwinned Ag films with (111) preferred orientation will have many potential applications in interconnects and 3D IC packaging.

Keywords: Nanotwins, thin film, TSV interconnection, 3D-IC, packaging.

Date Published: December 13, 2023
DOI: 10.11159.ijmmme.2023.005

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